PCB welding terminal hole and pad design: solder fill, pull force and temperature rise
A practical guide to hole size, pad geometry and soldering window for high-current PCB welding terminals, including clea...
Technical Guides & Company Updates — Page 17
Explore Hongchuan Metals technical guides, product information and company updates. Review PCB busbar, solder terminal and SMT nut selection considerations alongside the product catalog.
Tape-and-reel packaging for SMD copper busbars: nozzle pickup and SMT placement
Tape-and-reel packaging guide for SMD copper busbars: carrier pocket, nozzle pickup surface, tape orientation, coplanari...
high current PCB terminal loosening after thermal cycling Guide
Troubleshooting guide for high-current PCB terminal loosening after thermal cycling: torque retention, contact resistanc...
welding terminal plating for automotive power modules Guide
Terminal plating selection for automotive power modules: tin, nickel and silver compared by solderability, contact resis...
SMT nut pad design for reflow soldering on inverter control boards
SMT nut pad design guide for reflow soldering: floating, tilting, solder volume, torque stability and automated placemen...
solderable copper busbar vs thick copper PCB traces Guide
A comparison of thick-copper PCB traces and solderable copper busbars for BMS boards, local current bottlenecks, cost an...
SMD busbar thickness for high current PCB Guide
How to choose SMD busbar thickness for 40A-120A high-current PCB paths by current, temperature rise, pad exit, copper we...
Why high-current terminals still overheat after tightening: bolt torque, contact resistance, and anti-loosening design
High-current terminal overheating is not always caused by an undersized terminal. Many failures come from insufficient b...
How to design tape-and-reel packaging for SMD copper bars: nozzle pickup, tape orientation, and SMT production poka-yoke
Whether an SMD copper bar can enter stable SMT production depends not only on current-carrying capacity, but also on car...
Why SMT nuts float, tilt, or lose torque after reflow: pad design and solder-paste opening guide
When SMT nuts float, tilt, show weak solder joints, or lose torque stability after reflow, the root cause is rarely the ...
Why high-current PCB via arrays overheat: pad exits, copper bottlenecks, and SMD copper bar reinforcement
High-current PCB via-array heating is rarely caused only by having too few vias. It is usually the combined result of pa...
Tin, nickel, or silver plating for welding terminals: a guide to contact resistance, salt spray, and soldering process on high-current PCBs
Welding-terminal plating is not simply a matter of choosing the most expensive finish. Tin, nickel, and silver plating s...