How to select an EV OBC battery-side high-voltage PCB terminal: lug, torque and vibration validation
A practical guide to EV OBC battery-side high-voltage terminals, covering PCB welding terminals, cable lugs, holes and p...
Technical Guides & Company Updates — Page 6
Explore Hongchuan Metals technical guides, product information and company updates. Review PCB busbar, solder terminal and SMT nut selection considerations alongside the product catalog.
Electric-vehicle OBC high-current PCB connection design: SMD busbars, welding terminals and temperature-rise validation
A practical guide to high-current PCB connections in EV onboard charger power boards, covering the AC input, PFC/DC link...
Energy storage PCS high-current PCB connection design: SMD busbars, welding terminals and temperature-rise validation
A practical guide to high-current PCB connections in energy-storage PCS power boards, covering continuous current, overl...
Copper-aluminum composite busbar punching burrs and edge delamination: hole quality, plating damage and contact resistance
A practical guide to punched-hole quality in copper-aluminum composite busbars, covering punching direction, die clearan...
SMD busbar poor solderability after storage: plating oxidation, packaging, shelf life and solderability retest
A practical guide to poor solderability of SMD busbars after storage, covering plating oxidation, surface contamination,...
SMT nut pad lift and annular cracking after screw tightening: torque, PCB thickness, pull strength and thermal cycling
A practical guide to lifted pads, annular cracks and fractured solder joints around SMT nuts after screw tightening, cov...
PCB welding terminal flux residue after soldering: cleaning, ionic contamination, corrosion and contact resistance troubleshooting
A practical guide to flux residue around PCB welding terminals after soldering, covering cleaning process, ionic contami...
How to test copper-aluminum composite busbar peel strength: interface delamination, bending and contact resistance validation
A practical guide to copper-aluminum composite busbar peel strength and interface delamination, covering metallurgical b...
SMD busbar reflow solder voids and poor wetting: stencil, solder fillet, X-ray and temperature-rise validation
A practical guide to SMD busbar reflow solder voids and poor wetting, covering stencil openings, paste volume, pad oxida...
Solder in SMT nut threads after reflow: stencil opening, paste volume and thread-gauge inspection
Solder in SMT nut threads can affect bolt assembly, torque and locking. This guide covers stencil openings, paste volume...
PCB welding terminal selective versus wave soldering: thermal mass, hole fill and production window
Selective versus wave soldering for PCB welding terminals depends on thermal mass, board shadowing, flux, preheat, solde...
Copper-aluminum transition busbar bolted-joint design: washers, torque, corrosion and contact resistance
Copper-aluminum bolted-joint reliability depends on interface area, washer, torque, finish, corrosion and post-cycle cla...