HCSP busbars are available in multiple dimensions and materials; plating and packaging depend on the model. Check PCB pads, connection cross-section, clearance and soldering process. Current, contact resistance and temperature rise must be verified in the final assembly and cooling conditions.
Detailed product parameters and performance
| Material | T2 Copper, H62 Brass, Cu-Al Composite, Manganese Steel, Aluminum |
| Thickness Range | 0.3mm - 3.0mm |
| Current Capability | Verify for model, temperature-rise limit and assembly |
| Surface Treatment | Tin, Nickel, Silver, Gold Plating |
| Temperature Rise | Specify ambient temperature, current and cooling |
| Contact Resistance | Determine by testing the assembled connection |
| Packaging | Bulk, Tape Reel (SMT Compatible) |
| Compliance Documents | Confirm applicable documents by model and batch |
Current figures below are catalog references, not unconditional ratings. Check model details, thermal limits and test conditions.
Selected high-quality busbar products with rapid customization
Widely used in new energy and industrial sectors
Battery pack busbars, BMS terminals, charging systems
Module connection, distribution terminals, monitoring
DC busbars, AC terminals, IGBT connection
VFD, PLC cabinets, servo drivers
High power modules, power distribution
SMPS, DC/DC converters, UPS systems
Select PCB busbars by dimensions, cross-section, material and soldering method. Compare catalog models, then confirm thermal limits, packaging, samples and lead time.