Compare dimensions, material and finish before choosing a solderable PCB bus bar. Open a model for its specifications and available drawing. Confirm plating, PCB pads and your soldering process together; current capability depends on the complete assembly and cooling conditions.
| Model | Length × width × thickness | Material / finish | Packaging | Specifications |
|---|---|---|---|---|
| HCSP-1241BN-TR | 12 × 4 × 1 | Brass / Nickel | Tape & reel | Model details Drawing PDF |
| HCSP-1033CN-TR | 10 × 3 × 3 | Copper / Nickel | Tape & reel | Model details Drawing PDF |
| HCSP-1022BN-TR | 10 × 2 × 2 | Brass / Nickel | Tape & reel | Model details Drawing PDF |
| HCSP-181308BG-TR | 1.8 × 1.3 × 0.8 | Brass / Gold | Tape & reel | Model details Drawing PDF |
| HCSP-1021BN-TR | 10 × 2 × 1 | Brass / Nickel | Tape & reel | Model details Drawing PDF |
| HCSP-1532BN-TR | 15 × 3 × 2 | Brass / Nickel | Tape & reel | Model details Drawing PDF |
For samples or a quote, include the model or dimensioned drawing, quantity, finish and packaging. Add operating current, ambient temperature and allowed temperature rise for an assembly review.
HCSP busbars are available in multiple dimensions and materials; plating and packaging depend on the model. Check PCB pads, connection cross-section, clearance and soldering process. Current, contact resistance and temperature rise must be verified in the final assembly and cooling conditions.
Detailed product parameters and performance
| Material | T2 Copper, H62 Brass, Cu-Al Composite, Manganese Steel, Aluminum |
| Thickness Range | 0.3mm - 3.0mm |
| Current Capability | Verify for model, temperature-rise limit and assembly |
| Surface Treatment | Tin, Nickel, Silver, Gold Plating |
| Temperature Rise | Specify ambient temperature, current and cooling |
| Contact Resistance | Determine by testing the assembled connection |
| Packaging | Bulk, Tape Reel (SMT Compatible) |
| Compliance Documents | Confirm applicable documents by model and batch |
Current figures below are catalog references, not unconditional ratings. Check model details, thermal limits and test conditions.
Selected high-quality busbar products with rapid customization
Select a PCB SMD busbar by dimensions, material, plating and assembly method. SMD busbar, SMT busbar and surface mount busbar describe related board-mounted conductors; compare the actual model drawing. Distinguish copper from brass and validate operating current with the solder joints, PCB copper, ambient temperature and permitted temperature rise.
| Item | Information and conditions |
|---|---|
| Geometry and material | Provide length × width × thickness in mm, material grade and tolerances. For a rectangular straight bar, cross-section is width × thickness in mm²; also check the solder contact area. |
| Plating and soldering | Confirm tin or nickel finish, coating thickness and soldering process for the model. A finish label alone does not establish solderability in your reflow process. |
| Tape, reel and delivery | Include sample quantity, production quantity and target delivery date. Request confirmation of tape width, pocket geometry, feed orientation and parts per reel. |
The HCSP-1033CN-TR catalog lists copper, nickel plating and tape-and-reel packaging. Its rectangular cross-section is 9 mm². Confirm drawing revision, tolerances, pads and finish requirements before ordering and request samples for validation.
Send a dimensioned drawing or part number with material, finish, soldering method and quantity. Continuous current in A, peak duration in ms, ambient temperature in °C and permitted temperature rise in K define validation conditions. Price and lead time are confirmed per project.
Widely used in new energy and industrial sectors
Battery pack busbars, BMS terminals, charging systems
Module connection, distribution terminals, monitoring
DC busbars, AC terminals, IGBT connection
VFD, PLC cabinets, servo drivers
High power modules, power distribution
SMPS, DC/DC converters, UPS systems
Select PCB busbars by dimensions, cross-section, material and soldering method. Compare catalog models, then confirm thermal limits, packaging, samples and lead time.