Advanced Composite Conductor Material

Cu-Al Eutectic Busbar
Solid-Liquid Cast-Rolling Composite Material

Utilizing unique Solid-Liquid Cast-Rolling Technology to achieve atomic-level metallurgical bonding. This material reduces overall costs by over 40% and weight by over 50% compared to pure copper, serving as an ideal conductor for new energy and electrical equipment.

>148N/mm Peel Strength

40%+ Cost Efficiency

3.94g/cm³ Material Density

Copper-Aluminum Eutectic Busbar Product Image

Material Characteristics

Manufactured using advanced Solid-Liquid Cast-Rolling Technology, this Copper-Aluminum Composite offers physical properties superior to traditional cladding or welding processes.

01
Solid-Liquid Cast Rolling
Simultaneous introduction of solid copper strip during aluminum phase transition ensures atomic penetration and eliminates delamination.
02
Eutectic Layer Control
Eutectic layer precisely controlled at 300-500nm to balance bonding strength and conductivity.
03
Q-Edge Process
Rounded edges for better fit with insulation materials, suitable for high-end busbar processing.

Process Principle: Solid-Liquid Cast Rolling Flow

Material Comparison Analysis

Compared to traditional CCA (mechanical cladding/welding) and pure copper busbars, Solid-Liquid Cast-Rolling Cu-Al Eutectic Busbar offers significant advantages in bonding strength, processability, and cost-efficiency.

Dimension	Pure Copper (T2/T3)	Traditional CCA (Clad/Weld)	Solid-Liquid Cast-Rolling Eutectic Busbar
Bonding Method	-	Mechanical/Weak Metallurgical	Atomic Metallurgical (Eutectic)
Peel Strength	-	Low (Prone to delamination)	> 148 N/mm (Very High)
Processability (Bending)	Excellent	Poor (Cracks/Peeling)	Excellent (90° No Cracks)
Conductivity (IACS)	~100%	65% - 85%	Customizable by Cu ratio
Density	8.9	~3.5 - 4.5	3.94 (Lightweight)
Overall Cost	High	Medium	Low (40%+ savings vs Cu)

* Note: Data based on typical values; specific performance depends on customization.

Key Material Properties

The following data is based on third-party authoritative testing, reflecting the excellent mechanical and electrical performance of the Cu-Al Eutectic Busbar.

Test Item	Performance Data	Notes
Interface Peel Strength	> 148 N/mm	Far exceeds GB std, no cracking in processing
Shear Strength	> 63.6 N/mm	Stable and reliable structure
Tensile Strength	> 136 N/mm²	Excellent mechanical strength
Bending Performance	90° No Cracks	Suitable for complex busbar bending
DC Resistivity	≤ 0.02350 Ω·mm²/m	Better than national standard

Specifications

Single/Double-sided Cu customization. Thickness 1.5-12mm, Width up to 800mm.

Spec (mm)	Current (50K Rise)	Weight vs Copper
40 x 4	~468 A	44%
50 x 5	~635 A	44%
60 x 6	~903 A	44%
100 x 10	~1800 A	44%

Request Quote & Samples

We provide sample testing and selection support for this composite material.

Sales Manager

Kevin Chen

+86 18938685515