HCSP terminals connect PCBs to external conductors. Material, pin geometry and threads vary by model; select the soldering process against the drawing. Verify resistance, temperature rise and mechanical strength with the intended PCB pads, copper thickness, solder and fastening conditions.
Detailed product parameters
| Material | T2 Copper, H62 Brass, C1100, C2680 |
| Thickness | 0.5mm - 5.0mm |
| Thread Size | M3-M10 (Internal/External) |
| Plating | Matte Tin, Nickel, Silver |
| Mounting | THR, Wave Soldering, Press-fit |
| Torque Requirements | Verify by thread, material and mounting method |
| Packaging | Tray, Tape & Reel (SMT) |
| Compliance Documents | Confirm applicable documents by model and batch |
Widely used in New Energy & Power Electronics
Main board to busbar connection
High current I/O terminals
Internal connection of HV PDU
Server PSU, Telecom power modules
IGBT connection, 3-phase output
AC/DC power module connection
Share dimensions, thread, board thickness, mounting method and quantity to identify catalog or custom options. Samples, tooling, packaging and lead time are confirmed per project.