Hongchuan Metals

SMD vs. Through-Hole Terminal Cost Analysis: A Manufacturing Efficiency Matrix

A deep dive into the total cost of ownership (TCO) differences between Surface Mount Device (SMD) and Through-Hole Techn...

Explore how Cell-to-Pack (CTP) battery technology is driving down interconnect costs in 2026 through component reduction...

Manual soldering is often the bottleneck in BMS manufacturing. Discover how switching to HC-SP's SMT components like SMD...

When PCB currents exceed 200A, increasing copper weight hits thermal and cost limits. We analyze IPC-2152 constraints an...

Battery line fires are frequently caused by loose connections and thermal runaway. Human tightening torque deviation is ...

The new GB38031-2025 standard mandates a 2-hour delay or 'no fire' rule for EV battery thermal runaway. Instead of costl...

With the release of GB 38031-2025, battery pack safety standards have escalated. This article explores how HC-SP's mold-...

As 2025 marks the dawn of solid-state battery commercialization, rapid R&D is vital. HC-SP introduces 'No-Mold' custom s...

As the New Energy Vehicle industry accelerates towards 800V high-voltage platforms in 2024, the current-carrying capacit...

In high-power density power designs, traditional PCB copper traces often struggle to handle continuous high-current load...

Handling 100A+ currents on PCBs requires more than just thicker copper. Discover how SMT Busbars act as "current overpas...

A detailed comparison between nickel and tin-plated busbars in terms of conductivity, corrosion resistance, and thermal ...