PCB welding terminal selective versus wave soldering: thermal mass, hole fill and production window
Selective versus wave soldering for PCB welding terminals depends on thermal mass, board shadowing, flux, preheat, solde...
Guide | Technical Guides & Company Updates — Page 6
Explore Hongchuan Metals technical guides, product information and company updates. Review PCB busbar, solder terminal and SMT nut selection considerations alongside the product catalog.
Copper-aluminum transition busbar bolted-joint design: washers, torque, corrosion and contact resistance
Copper-aluminum bolted-joint reliability depends on interface area, washer, torque, finish, corrosion and post-cycle cla...
SMD busbar pad-exit heating: copper neck-down, via arrays and parallel current-sharing troubleshooting
When an SMD busbar body is cool but its pad exit is hot, the issue is often copper neck-down, via capacity, inner-layer ...
How to measure PCB welding terminal temperature rise: current points, contact resistance and acceptance
A practical method for PCB welding terminal temperature-rise testing, covering current conditions, terminal body, solder...
How to choose tin, nickel and silver plating for SMD busbars: solderability, salt spray and contact resistance
A practical SMD busbar plating guide covering tin, nickel and silver finishes for solderability, contact resistance, sal...
How to choose M2, M3 and M4 SMT nuts: PCB thickness, torque and pull-out force
A practical guide to M2, M3 and M4 SMT nut selection, covering PCB thickness, tightening torque, pull-out force, shear l...
Why copper-aluminum connectors corrode: galvanic corrosion, plating and contact resistance
A practical guide to galvanic corrosion in copper-aluminum connectors, covering Cu-Al interfaces, tin or nickel plating,...
PCB welding terminal hole and pad design: solder fill, pull force and temperature rise
A practical guide to hole size, pad geometry and soldering window for high-current PCB welding terminals, including clea...
Tape-and-reel packaging for SMD copper busbars: nozzle pickup and SMT placement
Tape-and-reel packaging guide for SMD copper busbars: carrier pocket, nozzle pickup surface, tape orientation, coplanari...
high current PCB terminal loosening after thermal cycling Guide
Troubleshooting guide for high-current PCB terminal loosening after thermal cycling: torque retention, contact resistanc...
welding terminal plating for automotive power modules Guide
Terminal plating selection for automotive power modules: tin, nickel and silver compared by solderability, contact resis...
SMT nut pad design for reflow soldering on inverter control boards
SMT nut pad design guide for reflow soldering: floating, tilting, solder volume, torque stability and automated placemen...