Hongchuan Metals

SMD vs. Through-Hole Terminal Cost Analysis: A Manufacturing Efficiency Matrix

A deep dive into the total cost of ownership (TCO) differences between Surface Mount Device (SMD) and Through-Hole Techn...

An in-depth analysis of Section 232 and trade tariff impacts on copper costs, offering sourcing alternatives for Tier 1 ...

Explore how Cell-to-Pack (CTP) battery technology is driving down interconnect costs in 2026 through component reduction...

Manual soldering is often the bottleneck in BMS manufacturing. Discover how switching to HC-SP's SMT components like SMD...

When PCB currents exceed 200A, increasing copper weight hits thermal and cost limits. We analyze IPC-2152 constraints an...

Battery line fires are frequently caused by loose connections and thermal runaway. Human tightening torque deviation is ...

The new GB38031-2025 standard mandates a 2-hour delay or 'no fire' rule for EV battery thermal runaway. Instead of costl...

With analysts forecasting copper prices to reach $13,000/t by 2026 due to structural deficits, manufacturers face urgent...

With the release of GB 38031-2025, battery pack safety standards have escalated. This article explores how HC-SP's mold-...

As 2025 marks the dawn of solid-state battery commercialization, rapid R&D is vital. HC-SP introduces 'No-Mold' custom s...

As EVs shift to 800V platforms and 5C supercharging, integrated drive systems face severe thermal challenges. This artic...

As the New Energy Vehicle industry accelerates towards 800V high-voltage platforms in 2024, the current-carrying capacit...